Sierra Components’ Wafer Processing Capabilities Include:

WAFER DICING

State of the art disco dad3240 and fully automatic world class kulicke & soffa precision dicing systems handle ceramic, silicon and gaas wafers ranging from fragments to 8-inch diameter. Wafer cleanliness is maintained to a minimum of 5 meg ω resistivity quality di water and anti-static work stations.

PICK & PLACE

Semi-automatic pick & place available to place dice in waffle pack or gelpack is ideal for a wide range of die including those sensitive to topside handling.

DIE INSPECTION

100% visual inspection available to the specification you need. All operators are trained & certified to commercial, mil-std-883, method 2010 cond a & b, and customer specific requirements.

QUALITY QUICK-TURN

Our machines are equipped with state of the art high definition optics allowing the most scrupulous and rapid inspections possible.

INDIVIDUAL SERVICE

Each order is entered on custom traveler generated for each customer’s specific requirements allowing for reliable process flow.

FOR PROTOTYPE QUANTITIES OR HIGH-VOLUME PRODUCTION RUNS:

Sierra Components is the answer to any wafer dicing requirements. We can dice wafers in preparation for assembly or for Die Sales shipments to customers anywhere in the world, specializing in quick turn dicing. All of our dicing is done utilizing our World-Class Disco DAD3240 and Kulicke & Soffa Precision Dicing System. Our highly experienced operators are experts in handling wafers of all types. We can provide 100% die inspection to MIL-STD-883 or Commercial specifications or we will train and certify our die inspectors to your custom specification.

Whether you need thousands of dice per month or 100 die today, Sierra Components is the supplier to choose. We have built our reputation on providing customers with excellent quality and superior service in the die distribution business, now let us show you what we can do for your wafer processing requirements.